Comparison between Magnetic Fields and Electric Fields of Microwave Radiation for Heating the Solder Used to Connect a Transistor to a Printed Circuit Board

We demonstrated soldering of an electrical component (the metal-oxide semiconductor field effect transistor (MOSFET)) on a printed circuit bord (PCB) via solder paste heated by microwave irradiation. The behavior the object soldered with in magnetic and electric were evaluated using various resonators. In field, was selectively confirmed that MOSFET connected onto PCB without any damage operated normally. However, cannot be irradiation because edges heated. Consequently, could not PCB. strengths electromagnetic fields produced different resonators numerically simulated to determine optimal positions for soldering. Based simulation results, heating separate carried out we investigated characteristics samples. appearance cross sections samples observed scanning electron microscopy energy dispersive X-ray spectroscopy. To estimate MOSFET, output transfer MOSFET. conclude superior field.